EN
SR EN IEC 60286-3:2019
Pregătirea componentelor electronice pentru operații automatizate. Partea 3: Ambalarea componentelor cu montare pe suprafață în benzi continue
<!-- NEW! -->IEC 60286-3:2019 is available as <a href="https://webstore.iec.ch/publication/64533">IEC 60286-3:2019 RLV</a> which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.</br></br>IEC 60286-3:2019 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This edition includes the following significant technical changes with respect to the previous edition: - addition of a table of the classification to symbols concerning tape, reel and common symbols; - additions of a figure of example of polarity and orientation and a figure of example of dot seal; - revision of requirements for camber; - addition of a definition of design value
Status :
Anulat
Data aprobării : 30.09.2019
Data anulării : 20.12.2025
Număr de pagini : 92
ICS : 31.020 Componente electronice în general,31.240 Structuri mecanice pentru echipament electronic
Comitet tehnic : 36 - Electronică de putere, condensatoare de putere, condensatoare şi rezistoare pentru echipamente electronice
- Inlocuieste SR EN 60286-3:2014
- Inlocuieste SR EN 60286-3:2014/AC:2014
- Inlocuit prin SR EN IEC 60286-3:2023