EN
SR EN 60286-3:2014
Pregătirea componentelor electronice pentru operaţii automatizate. Partea 3: Ambalarea componentelor cu montare pe suprafaţă în benzi continue
IEC 60286-3:2013 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This standard also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This fifth edition cancels and replaces the fourth edition, published in 2007, as well as IEC 60286-3-1, published in 2009 and IEC 60286-3-2, published in 2009. It constitutes a full layout revision. In addition, this edition includes the following significant technical changes with respect to the previous edition: a) integration of IEC 60286-3-1:2009 as type 1b (Packaging of surface mount components on continuous pressed carrier tapes); b) integration of IEC 60286-3-2:2009 as type 2b (Packaging of surface mount components on blister carrier tapes 4 mm in width).
Status :
Anulat
Data aprobării : 28.02.2014
Data anulării : 20.02.2022
Număr de pagini : 86
ICS : 31.020 Componente electronice în general,31.240 Structuri mecanice pentru echipament electronic
Comitet tehnic : 36 - Electronică de putere, condensatoare de putere, condensatoare şi rezistoare pentru echipamente electronice
- Inlocuieste SR EN 60286-3:2008
- Inlocuieste SR EN 60286-3-2:2010
- Inlocuieste SR EN 60286-3-1:2010
- Inlocuit prin SR EN IEC 60286-3:2019
- Modificat de SR EN 60286-3:2014/AC:2014