EN
SR EN IEC 60749-20:2020
Dispozitive cu semiconductoare. Metode de încercări mecano-climatice. Partea 20: Rezistenţa dispozitivelor SMD încapsulate în plastic la efectul combinat al umidităţii şi căldurii din timpul lipirii
<!-- NEW! -->IEC 60749-20:2020 is available as <a href="https://webstore.iec.ch/publication/67549">IEC 60749-20:2020 RLV</a> which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.</br></br>IEC 60749-20:2020 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This edition includes the following significant technical changes with respect to the previous edition: - incorporation of a technical corrigendum to IEC 60749-20:2008 (second edition ); - inclusion of new Clause 3; - inclusion of explanatory notes.
Status :
In vigoare
Data aprobării : 23.12.2020
Număr de pagini : 64
ICS : 31.080.01 Dispozitive cu semiconductoare în general
Comitet tehnic : 17 - Dispozitive cu semiconductoare
- Inlocuieste SR EN 60749-20:2010