EN
SR EN IEC 61190-1-3:2018
Materiale de fixare pentru asamblarea componentelor electronice. Partea 1-3: Cerinţe privind aliajele de sudură de categorie electronică şi sudurile solide cu sau fără flux pentru aplicaţiile de sudură electronice
IEC 61190-1-3:2017 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. This edition includes the following significant technical changes with respect to the previous edition: a) The maximum impurity level of Pb has been revised and the table of lead free solder alloys includes some additional lead free solder alloys.
Status :
In vigoare
Data aprobării : 28.09.2018
Număr de pagini : 94
ICS : 31.190 Ansambluri de componente electronice
Comitet tehnic : 193 - Tehnologia asamblării componentelor electronice
- Inlocuieste SR EN 61190-1-3:2007/A1:2011
- Inlocuieste SR EN 61190-1-3:2007