EN
SR EN 61190-1-3:2007
Materiale de fixare pentru asamblarea componentelor electronice. Partea 1-3: Cerinţe privind aliajele de sudură de categorie electronică şi sudurile solide cu sau fără flux pentru aplicaţiile de sudură electronice
IEC 61190-1-3:2007 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. This standard is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an amendment to Table B.1 concerning lead-free solder alloys.
Status :
Anulat
Data aprobării : 17.12.2007
Data publicării : 19.12.2007
Data anulării : 17.01.2021
Număr de pagini : 41
ICS : 31.190 Ansambluri de componente electronice
Comitet tehnic : 193 - Tehnologia asamblării componentelor electronice
- Inlocuieste SR EN 61190-1-3:2003
- Inlocuit prin SR EN IEC 61190-1-3:2018
- Modificat de SR EN 61190-1-3:2007/A1:2011