EN
SR EN 60068-2-69:2017
Încercări de mediu. Partea 2-69: Încercări Încercare Te/Tc: Încercare de sudabilitate a componentelor electronice şi a plăcilor imprimate prin metoda balanţei de umectare (măsurarea forţei)
IEC 60068-2-69:2017 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass–fail purposes. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads. This document provides the measurement procedures for solder alloys both with and without lead (Pb). This edition includes the following significant technical changes with respect to the previous edition: - integration of IEC 60068-2-54; - inclusion of tests of printed boards; - inclusion of new component types, and updating test parameters for the whole component list; - inclusion of a new gauge R & R test protocol to ensure that the respective wetting balance equipment is correctly calibrated.
Status :
In vigoare
Data aprobării : 22.12.2017
Număr de pagini : 118
ICS : 19.040 Încercari de mediu,31.190 Ansambluri de componente electronice
Comitet tehnic : 193 - Tehnologia asamblării componentelor electronice
- Inlocuieste SR EN 60068-2-54:2007
- Inlocuieste SR EN 60068-2-69:2008
- Modificat de SR EN 60068-2-69:2017/AC:2018