SR EN 50310:2017/A2:2026
Utilizarea legăturii echipotenţiale şi de punere la pământ în clădiri cu echipamente de tehnologia informaţiei
This document specifies requirements and provides recommendations for the design and installation of connections (bonds) between various electrically conductive elements in buildings and other structures, during their construction or refurbishment, in which information or telecommunications technology equipment is intended to be installed in order to: a) minimise the d.c. and a.c. potential differences in order to reduce the risk of malfunction of that equipment and interconnecting cabling due to electromagnetic disturbance; b) provide the telecommunications installation with a reliable signal reference – which may improve immunity from electromagnetic interference (EMI). The requirements of this European Standard are applicable to the buildings and other structures within premises addressed by EN 50174-2 (e.g. residential, office, industrial and data centres) but information given in this European Standard may be of assistance for other types of buildings and structures. NOTE Telecommunications centres (operator buildings) are addressed by ETSI/EN 300 253. This European Standard doe
Status :
In vigoare
Data aprobării : 31.08.2026
Număr de pagini : 10
ICS : 29.120.50 Sigurante fuzibile si alte aparate de protectie la scurtcircuit,91.140.50 Sisteme de alimentare cu energie electrica
Comitet tehnic : 207 - Interconexiunea echipamentelor pentru tehnologia informaţiei
- Modifica SR EN 50310:2017
EN