EN
SR EN 60068-2-20:2009
Încercări de mediu. Partea 2-20: Încercări. Încercarea T: Metode de încercare de sudabilitate şi rezistenţă la căldura de sudură pentru dispozitivele cu terminale
IEC 60068-2-20:2008(E) outlines Test T, applicable to devices with leads. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this standard include the solder bath method and soldering iron method. The objective of this standard is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering. The major technical changes with regard to the fourth edition are the following: - the solder globule test is deleted; - test conditions and requirements for lead-free solders are added.
Status :
Anulat
Data aprobării : 18.03.2009
Data publicării : 20.03.2009
Data anulării : 04.05.2024
Număr de pagini : 26
ICS : 19.040 Încercari de mediu
Comitet tehnic : 193 - Tehnologia asamblării componentelor electronice
- Inlocuieste SR HD 323.2.20 S3:2004
- Inlocuit prin SR EN IEC 60068-2-20:2021